I would guess that Intel is using Insulated Gate Bipolar Transistors (IGBT's) in their new super multi core cpu's. I have read suggestions that something is different. Maybe it is just as simple as in the core connections via new in-cpu chip BUS additions. Maybe something else.
It has been common for transistors to have three lines to them. Two with an on-off switch between them. And one that supplies potential which is used as a "gate switch" which turns on or off the switch. Years ago the gate was insulated and thus the "Insulate Gate" of the Insulated Gate Bipolar Transistor. This is a years old design that has been commonly available on ebay up to 1,000,000 watt capacity (1,000 volt capacity and 1,000 amp capacity) in single phase.
My question relates to the IGBT's that Intel is probably using in their cpu's. Do these new chips use the many years old IGBT basic design or a new design? I am not asking if they are smaller or have thinner lines. I am not asking if they are cooler. I am not asking if they are made via multi-die.
Do these new chips use the many years old IGBT basic design or a new design?
Thanks.
It has been common for transistors to have three lines to them. Two with an on-off switch between them. And one that supplies potential which is used as a "gate switch" which turns on or off the switch. Years ago the gate was insulated and thus the "Insulate Gate" of the Insulated Gate Bipolar Transistor. This is a years old design that has been commonly available on ebay up to 1,000,000 watt capacity (1,000 volt capacity and 1,000 amp capacity) in single phase.
My question relates to the IGBT's that Intel is probably using in their cpu's. Do these new chips use the many years old IGBT basic design or a new design? I am not asking if they are smaller or have thinner lines. I am not asking if they are cooler. I am not asking if they are made via multi-die.
Do these new chips use the many years old IGBT basic design or a new design?
Thanks.
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